发明名称 |
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
摘要 |
A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.
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申请公布号 |
US2006194525(A1) |
申请公布日期 |
2006.08.31 |
申请号 |
US20060329648 |
申请日期 |
2006.01.10 |
申请人 |
APPLIED MATERIALS, INC., A DELAWARE CORPORATION |
发明人 |
TOLLES ROBERT D.;SHENDON NORM;SOMEKH SASSON;PERLOV ILYA;GANTVARG EUGENE;LEE HARRY Q. |
分类号 |
B24B9/00;B24B27/00;B24B37/04;B24B41/00;B24B41/06;B24B53/007;B24B53/12;B24B57/02;H01L21/00;H01L21/306 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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