| 摘要 |
Disclosed are a cleaning kit for a wire bonding apparatus capable of effectively removing foreign substances adhered to an end of a capillary while using the wire bonding for a long period of time, a wire bonding apparatus comprising the same, and a capillary cleaning method using the same. The cleaning kit for the wire bonding apparatus, according to an embodiment of the present invention, is a cleaning kit which fixes a wire bonding object and is used by being fixedly mounted to a window clamp having holes or as a removable type. The cleaning kit for the wire bonding apparatus comprises: a vibration generating plate mounted on the window clamp; and a polishing sheet attached to the vibration generating plate to be linked with the vibration generating plate. |
