发明名称 WIRING BOARD MODULE AND METHOD FOR MANUFACTURING THE WIRING BOARD MODULE
摘要 <p>[PROBLEMS] To mount a component also on the rear surface of a connecting section to an FPC, in a PCB connected to the FPC. [MEANS FOR SOLVING PROBLEMS] A wiring board module is provided with a connecting section wherein a conductor wiring of a first wiring board and a conductor wiring of a second wiring board are connected by an anisotropic conductive adhesive. The anisotropic conductive adhesive contains needle-shaped metal powder or straight chain metal powder in an insulating resin aligned in the thickness direction in the adhesion direction. A component is mounted at least on the first wiring board and the second wiring board, and the component is mounted on the rear surface opposite to the front surface whereupon the connecting section is formed.</p>
申请公布号 WO2008114546(A1) 申请公布日期 2008.09.25
申请号 WO2008JP52174 申请日期 2008.02.08
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;KOYAMA, KEIJI;YAMAMOTO, MASAMICHI;MIKAGE, KATSUNARI;PARK, JIN-JOO 发明人 KOYAMA, KEIJI;YAMAMOTO, MASAMICHI;MIKAGE, KATSUNARI;PARK, JIN-JOO
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
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