| 主权项 |
1. An electronic device package box adapted to be mounted with a plurality of first and second electronic components, comprising:
a first base unit including a first base and a plurality of first connecting pins that are inserted into said first base and that are spaced apart from one another, said first base having a first abutment surface, a first mounting surface that is opposite to said first abutment surface in a stacking direction and that is adapted to be mounted with the first electronic components, and a first pin-protruding surface that is spaced apart from said first abutment surface in the stacking direction and that surrounds said first mounting surface, each of said first connecting pins having a first wire-connecting portion that projects from said first pin-protruding surface and that is electrically connected to one of the first electronic components; and a second base unit connected to said first base unit in the stacking direction, and including a second base and a plurality of second connecting pins that are inserted into said first and second bases and that are spaced apart from one another, said second base having a second abutment surface that abuts against said first abutment surface of said first base, a second mounting surface that is opposite to said second abutment surface in the stacking direction and that is adapted to be mounted the second electronic components, and a second pin-protruding surface that is spaced apart from said second abutment surface in the stacking direction and that surrounds said second mounting surface, each of said second connecting pins having a second wire-connecting portion that projects from said second pin-protruding surface and that is electrically connected to one of the second electronic components, and a protrusion portion that projects from said first pin-protruding surface of said first base. |
