| 发明名称 |
ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MAKING AND USING THE SAME |
| 摘要 |
An electronic package is provided. The electronic package includes a substrate and a plurality of vias defined by a corresponding plurality of pre-defined via patterns. The electronic package further a metal built-up layer disposed on portions of the substrate to provide a plurality of pre-defined via locations and the plurality of pre-defined via patterns of the plurality of vias. Also, the electronic package includes a first conductive layer disposed on at least a portion of the metal built-up layer. Moreover, the electronic package includes a second conductive layer disposed on the first conductive layer, where the plurality of vias is disposed at least in part in the metal built-up layer, the first conductive layer, and the second conductive layer. |
| 申请公布号 |
US2016183376(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414580269 |
申请日期 |
2014.12.23 |
| 申请人 |
General Electric Company |
发明人 |
Gowda Arun Virupaksha;McConnelee Paul Alan;Tuominen Risto Ilkka |
| 分类号 |
H05K1/18;H05K3/30;H05K3/00;H05K1/09;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package, comprising:
a substrate; a plurality of vias defined by a corresponding plurality of pre-defined via patterns; a metal built-up layer disposed on portions of the substrate to provide a plurality of pre-defined via locations and the plurality of pre-defined via patterns of the plurality of vias; a first conductive layer disposed on at least a portion of the metal built-up layer; and a second conductive layer disposed on the first conductive layer, wherein the plurality of vias is disposed at least in part in the metal built-up layer, the first conductive layer, and the second conductive layer. |
| 地址 |
Schenectady NY US |
