SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor device and a method of manufacturing the same. The purpose of the present invention is to provide a semiconductor device which can reduce manufacturing costs and can have a reduced thickness using an interposer having no through electrode, and a method of manufacturing the semiconductor device. For this purpose, the semiconductor device comprises: an interposer including a first surface and a second surface, having a first pad and a first post formed on the first surface, and having a second pad formed on the second surface; a first semiconductor die electrically connected to the first pad of the interposer; a first encapsulant encapsulating the first post and the first semiconductor die; a second semiconductor die electrically connected to the second pad of the interposer; and a conductive bump electrically connected to the first post.