SEMICONDUCTOR INTEGRATED DEVICE FOR ACOUSTIC APPLICATIONS WITH CONTAMINATION PROTECTION ELEMENT, AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

主权项

1. A semiconductor integrated device, comprising:
a package having a base element and a covering element jointly defining an internal space of the package, said base element having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer housed in the internal space of said package and including an acoustic chamber facing the acoustic-access opening; and a filtering module configured to inhibit passage of contaminating particles having dimensions larger than a filtering dimension, the filtering module being located between the MEMS acoustic transducer and the acoustic-access opening, said filtering module forming at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.