| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of satisfactorily dividing a substrate with a pattern including a metal film as a reflection film.SOLUTION: A dividing method is disclosed for dividing a substrate with a pattern formed by laminating a multilayer film which is formed by iteratively and alternately laminating two oxide films different from each other, and a metal layer on a principal surface at a side opposite to a surface on which a unit device pattern is formed. The method of dividing the substrate with the pattern includes: a metal film removal step of removing only the metal film along a predetermined processing line which is predetermined on the substrate with the pattern, to form a processing groove by moving a tool which includes a tip in a distal end, relatively to the substrate with the pattern in the state where the distal end of the tool is positioned at the height of an interface between the multilayer film and the metal layer; a crack extension processing step of extending a crack, along the predetermined processing line, from each processing mark which is formed on the substrate with the pattern by each of unit pulse light, by irradiating the substrate with the pattern with laser light in such a manner that the processing marks are positioned discretely in the processing groove; and a break step of breaking the crack-extended substrate with the pattern along the predetermined processing line. |
