| 发明名称 |
REAR SURFACE-PROTECTIVE FILM FOR PROTECTING REAR SURFACE OF SEMICONDUCTOR ELEMENT, INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CHIP |
| 摘要 |
Disclosed is a rear surface-protective film making it possible to watch, across this rear surface-protective film, a crack of a semiconductor element through an infrared camera, and the like. is the invention relates to a rear surface-protective film for protecting a rear surface of a semiconductor element, the film having a parallel light transmittance of 15% or more at a wavelength of 800 nm. The ratio of the parallel light transmittance at a wavelength of 800 nm to the parallel light transmittance at a wavelength of 532 nm in the rear surface-protective film is preferably 2 or more. |
| 申请公布号 |
US2016322252(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201615141336 |
申请日期 |
2016.04.28 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TAKAMOTO Naohide;KIMURA Ryuichi |
| 分类号 |
H01L21/683;H01L21/78;H01L23/31;H01L23/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A rear surface-protective film for protecting a rear surface of a semiconductor element,
wherein the rear surface-protective film has a parallel light transmittance of 15% or more at a wavelength of 800 nm. |
| 地址 |
Osaka JP |
