| 摘要 |
A method of manufacturing a semiconductor device is provided. The method includes embedding and forming a coupling terminal as an external electrode of an electronic circuit on an active surface side of a substrate having an active surface formed with a plurality of electronic circuits, exposing a part of the coupling terminal by polishing a back surface side of the substrate, mounting a semiconductor chip on the back surface side of the substrate via the coupling terminal, sealing the semiconductor chip mounted on the substrate by a sealing material, and cutting the substrate for every forming area of each electronic circuit and dividing it into a plurality of semiconductor devices. |
