SEMICONDUCTOR WAFER EDGE TESTING APPARATUS AND WAFER EDGE TESTING METHOD

摘要

A semiconductor wafer edge inspecting apparatus and a wafer edge inspecting method are provided to control properly an additional strip process on a wafer edge region by using an image pickup unit and a control unit. A semiconductor wafer edge inspecting apparatus includes a spin chuck for loading stably a wafer, an image pickup unit and a control unit. The image pickup unit(300) is spaced apart from the spin chuck in order to obtain a variety of images from an edge region of the wafer. The control unit(400) is electrically connected with the image pickup unit. The control unit is used for controlling an additional strip process on the edge region of the wafer.