| 摘要 |
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an electrode pad disposed on the first principal surface of the semiconductor substrate and electrically connected to the semiconductor device, a through via formed in a through hole penetrating through the semiconductor substrate and the electrode pad, and an Au bump deposited on the electrode pad and the through via such as to electrically connect between the electrode pad and the through via.
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