发明名称 |
Light emitting diode encapsulation shape control |
摘要 |
A semiconductor optical device is encapsulated by disposing the semiconductor optical device in a cavity defined by a cavity wall. The cavity wall is coated with a coating material having a first surface energy. An encapsulant having a second surface energy is introduced into the cavity adjacent to the light emitting semiconductor. The encapsulant is solidified to form an outer surface having a shape that is a function of the first surface energy and the second surface energy.
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申请公布号 |
US2007096139(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20050265630 |
申请日期 |
2005.11.02 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
SCHULTZ JOHN C. |
分类号 |
H01L33/52;H01L33/54;H01L33/60 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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