| 摘要 |
Provided is a thermosetting resin composition, which is able to form cured films having high flatness on a substrate having low flatness, has high transparency and surface hardness and excellent various resistances, and is useful for protective films for optical devices. The thermosetting resin composition comprises (A) a copolymer of (a1) a polymerizable unsaturated compound having an oxyranyl group or oxetanyl group and (a2) other polymerizable unsaturated compound than the component (a1), (B) a compound having at least one carboxyl group and at least one (meth)acrylic group, and further (C) an adhesive aid consisting of a silane coupling agent having a reactive substituent.
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