| 摘要 |
A focus ring of a plasma processing apparatus for performing a plasma processing on a target substrate to be processed is disposed on the mounting table to surround the target substrate. The focus ring includes a first ring-shaped member made of a conductive material and having a stepped portion at an inner peripheral portion thereof, the stepped portion being positioned lower than a bottom surface of the target substrate mounted on the mounting table and extended below a peripheral portion of the target substrate. The focus ring further includes a second ring-shaped member made of an insulating material and disposed under the first ring-shaped member to be interposed between the first ring-shaped member and the mounting table.
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