发明名称 MACHINING END POINT DETECTING METHOD, GRINDING METHOD, AND GRINDER
摘要 <p>A method for detecting the timing of a machining end point (grinding stop, change of grinding condition) by computing a characteristic value of the surface to be machined of a machining object such as a substrate. A spectral waveform indicating the relation between the reflection intensity and the wavelength at the machining end point is created by using a reference machining object or by performing simulation calculation. According to the spectral waveform, the wavelengths at which the reflection intensity takes on maximum and minimum values are selected. A characteristic value with respect to the surface to be machined is computed from the reflection intensity at the selected wavelength. The feature point of the temporal variation of the characteristic value at the machining end point is set as the machining end point. By detecting the feature point while machining the machining object, the machining end point of the machining object is detected.</p>
申请公布号 WO2008044786(A1) 申请公布日期 2008.04.17
申请号 WO2007JP70030 申请日期 2007.10.05
申请人 EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA;SHIMIZU, NOBURU;OHTA, SHINRO;MARUYAMA, KOJI;KOBAYASHI, YOICHI;MITANI, RYUICHIRO;NAKAI, SHUNSUKE;SHIGETA, ATSUSHI 发明人 SHIMIZU, NOBURU;OHTA, SHINRO;MARUYAMA, KOJI;KOBAYASHI, YOICHI;MITANI, RYUICHIRO;NAKAI, SHUNSUKE;SHIGETA, ATSUSHI
分类号 H01L21/304;B24B37/013;B24B37/10;B24B49/10;B24B49/12 主分类号 H01L21/304
代理机构 代理人
主权项
地址