CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD
摘要
<p>Disclosed is a chemical mechanical polishing pad (10) to be fixed to a polishing plate (13) of a polishing apparatus. The chemical mechanical polishing pad (10) comprises a polishing layer (11) and an adhesive layer (12) arranged between the polishing layer and the polishing plate of the polishing apparatus. In this adhesive layer, the adhesive strength of a central region A including the central portion of the polishing layer is lower the adhesive strength of the other regions.</p>
