发明名称 FORMING METHOD OF ALUMINUM OXIDE LAYER, AND MANUFACTURING METHOD OF CHARGE TRAP MEMORY ELEMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a forming method of an aluminum oxide layer, and a manufacturing method of a charge trap type memory element which utilizes the same. SOLUTION: The forming method of an alpha aluminum oxide layer, along with a manufacturing method of a memory element which utilizes the same, includes a first step for forming an amorphous aluminum oxide layer on a lower part film, a second step for forming a crystalline auxiliary layer on the amorphous aluminum oxide layer, and a third step for crystallizing the amorphous aluminum oxide layer. The second step includes a step for forming an amorphous auxiliary layer on the amorphous aluminum oxide layer and a step for crystallizing the amorphous auxiliary layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009060102(A) 申请公布日期 2009.03.19
申请号 JP20080215719 申请日期 2008.08.25
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHOI SANG-MOO;SETSU KOSHU;SHIN WOONG-CHUL;PARK SANG-JIN;LEE EUN-HA;SUNG JUNG-HUN
分类号 H01L21/8247;H01L21/316;H01L21/318;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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