发明名称 |
FORMING METHOD OF ALUMINUM OXIDE LAYER, AND MANUFACTURING METHOD OF CHARGE TRAP MEMORY ELEMENT USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of an aluminum oxide layer, and a manufacturing method of a charge trap type memory element which utilizes the same. SOLUTION: The forming method of an alpha aluminum oxide layer, along with a manufacturing method of a memory element which utilizes the same, includes a first step for forming an amorphous aluminum oxide layer on a lower part film, a second step for forming a crystalline auxiliary layer on the amorphous aluminum oxide layer, and a third step for crystallizing the amorphous aluminum oxide layer. The second step includes a step for forming an amorphous auxiliary layer on the amorphous aluminum oxide layer and a step for crystallizing the amorphous auxiliary layer. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009060102(A) |
申请公布日期 |
2009.03.19 |
申请号 |
JP20080215719 |
申请日期 |
2008.08.25 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHOI SANG-MOO;SETSU KOSHU;SHIN WOONG-CHUL;PARK SANG-JIN;LEE EUN-HA;SUNG JUNG-HUN |
分类号 |
H01L21/8247;H01L21/316;H01L21/318;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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