发明名称 |
SEMICONDUCTOR CHIP SHAPE ALTERATION |
摘要 |
The invention is directed to an improved semiconductor chip that reduces crack initiation and propagation into the active area of a semiconductor chip. A semiconductor wafer includes dicing channels that separate semiconductor chips and holes through a portion of a semiconductor chip, which are located at the intersection of the dicing channels. Once diced from the semiconductor wafer, semiconductor chips are created without ninety degree angle corners. |
申请公布号 |
US2010019354(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
US20090573364 |
申请日期 |
2009.10.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ MUKTA G.;JUNG DAE-YOUNG;MELVILLE IAN D. |
分类号 |
H01L23/58;H01L23/544 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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