| 摘要 |
A light emitting device includes a substrate, a plurality of micro light emitting chips, a plurality of reflective structures and a plurality of conductive bumps. The substrate has a plurality of pads. The micro light emitting chips are disposed on the substrate in dispersion, and each of the micro light emitting chips includes a light emitting layer. The reflective structures are disposed around the micro light emitting chips in dispersion, and at least cover the micro light emitting layers of the light emitting chips. The conductive bumps are disposed corresponding to the micro light emitting chips and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically connected to the pads of the substrate through the conductive bumps. |
| 主权项 |
1. A light emitting device, comprising:
a substrate, having a plurality of pads; a plurality of micro light emitting chips, disposed on the substrate in dispersion, and each of the micro light emitting chips comprising a light emitting layer; a plurality of reflective structures, disposed around the micro light emitting chips in dispersion, and at least covering the light emitting layers of the micro light emitting chips; and a plurality of conductive bumps, disposed corresponding to the micro light emitting chips and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically connected to the pads of the substrate through the conductive bumps. |
