Low-Temperature Bonding and Sealing With Spaced Nanorods

摘要

The present disclosure provides improved systems and methods for low-temperature bonding and/or sealing with spaced nanorods. In exemplary embodiments, the present disclosure provides for the use of metallic nanorods to bond and seal two substrates. The properties of the resulting bond are mechanical strength comparable to adhesives, impermeability comparable to metals and long term stability comparable to metals. The bond may be attached to any flat substrate and superstate with strong adhesion. In certain embodiments, the bond is achieved at room temperature with only pressure or at a temperature above room temperature (e.g., about 150° C. or less) and reduced pressure. Exemplary bonds are both mechanically strong and substantially impermeable to oxygen and moisture.

主权项

1. A method for bonding or sealing substrates comprising:
a) providing a first substrate and a second substrate; b) depositing a first array of nanorods on the first substrate; c) depositing a second array of nanorods on the second substrate; d) aligning the first substrate over the second substrate, the first and second arrays of nanorods positioned and having adequate spacing between one another to allow for the interpenetration and inter-digitation of the first and second arrays when pressed together; and e) pressing the first substrate and the second substrate together to interpenetrate, inter-digitate, and bond the first and second arrays of nanorods to one another.