PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES

摘要

A microelectronic package may be formed with a picture frame stiffener surrounding a microelectronic die for reducing warpage of the microelectronic package. An embodiment for fabricating such a microelectronic package may include forming a microelectronic die having an active surface and an opposing back surface, wherein the microelectronic die active surface may be attached to a microelectronic substrate. A picture frame stiffener having an opening therethrough may be formed and placed on a release film, wherein a mold material may be deposited over the picture frame stiffener and the release film. The microelectronic die may be inserted into the mold material, wherein at least a portion of the microelectronic die extends into the picture frame opening. The release film may be removed and a portion of the mold material extending over the microelectronic die back surface may then be removed to form the microelectronic package.

主权项

1. A microelectronic package, comprising:
a microelectronic die having an active surface and a back surface, wherein the microelectronic die is electrically connected to a microelectronic substrate through interconnects extending between the microelectronic die active surface and a first surface of the microelectronic substrate; a mold material abutting the microelectronic device and the microelectronic substrate first surface; and a picture frame stiffener having a opening therethrough, wherein the picture frame stiffener is at least partially embedded in the mold material, wherein at least a portion of the microelectronic die extends into the picture frame opening, and wherein the mold material does not extend over the microelectronic die back surface.