MOLD FOR RESIN SEALING, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE

摘要

Provided is a mold for resin sealing manufactured inexpensively. Processing for cavities for the mold is performed by high-speed rotary cutting with a round cutter to form a first cavity and a second cavity, to thereby obtain the cavities formed in a multi-level fashion.

主权项

1. A mold for resin sealing of a semiconductor chip, comprising:
a first cavity formed through a surface of the mold; a second cavity formed through an inner bottom surface of the first cavity so as to overlap the first cavity in a plan view; and a level-difference portion formed around an upper surface of the second cavity, each of the first cavity and the second cavity having corner portions formed at four corners thereof, each of the corner portions having a predetermined curvature radius.