发明名称 ENCAPSULATION FILM FOR ELECTRONIC MEMBER
摘要 PROBLEM TO BE SOLVED: To provide an encapsulation film for electronic members such as a quantum dot-containing resin sheet, an electronic paper and an organic EL, good in transparency, barrier property and adhesiveness to an encapsulation material such as an EVA.SOLUTION: There is provided an encapsulation film for electronic members by laminating a coating layer formed from at least one or more resin selected from a polyester resin, an urethane resin and an acrylic resin and a melamine resin, a barrier layer and a protective layer containing an urethane resin on a single side of a polyester film sequentially and having water vapor permeation degree of the encapsulation film measured according to a JIS-K7129 B method under a measurement condition of a temperature of 40°C and humidity of 90%RH of 0.01 g/m/day or less.SELECTED DRAWING: Figure 1
申请公布号 JP2016117208(A) 申请公布日期 2016.06.30
申请号 JP20140258132 申请日期 2014.12.20
申请人 MITSUBISHI PLASTICS INC 发明人 IZAKI KIMIHIRO
分类号 B32B27/36;B32B27/30 主分类号 B32B27/36
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