发明名称 LIQUID RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a sealing resin composition which contains a large amount of a silica filler, has a small linear expansion coefficient and a certain degree of fluidity, allows good handling during potting, and alleviates stress thereby hardly causing cracks.SOLUTION: A liquid resin composition contains a silica filler, a matrix resin and a curative. The filler content of the liquid resin composition is 75 wt.% or more, and the matrix resin includes a thermosetting resin and a thermoplastic resin.SELECTED DRAWING: None
申请公布号 JP2016117822(A) 申请公布日期 2016.06.30
申请号 JP20140257895 申请日期 2014.12.19
申请人 MITSUBISHI CHEMICALS CORP 发明人 TANAKA TOSHIYUKI
分类号 C08L101/00;C08G77/16;C08K3/36;C08L29/14;C08L83/06;H01L23/29;H01L23/31 主分类号 C08L101/00
代理机构 代理人
主权项
地址