METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

主权项

1. A method for manufacturing an electronic component, the method comprising:
inserting a plurality of multilayer chips into a plurality of cavities formed in a pallet, respectively, the plurality of multilayer chips each including a laminated body having a plurality of ceramic layers and a plurality of internal electrode layers; aligning the plurality of multilayer chips by moving each of the plurality of multilayer chips to one of inner wall surfaces that form the cavities; applying a conductive ink to ends of the plurality of aligned multilayer chips, and an upper surface of the pallet; and drying the applied conductive ink to form external electrodes on the plurality of multilayer chips.