| 发明名称 |
METHOD FOR BONDING SUBSTRATES |
| 摘要 |
A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding. |
| 申请公布号 |
SG11201603148V(A) |
申请公布日期 |
2016.07.28 |
| 申请号 |
SG11201603148V |
申请日期 |
2014.11.18 |
| 申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
FEHKÜHRER, ANDREAS;INVENTOR_NAME |
| 分类号 |
H01L21/98;B32B37/10;H01L21/18;H01L21/68;H01L21/683;H01L21/687;H01L25/065 |
主分类号 |
H01L21/98 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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