发明名称 IMPROVED COATED COPPER WIRE FOR BONDING APPLICATIONS
摘要 The present invention relates to a wire comprising a core with a surface, a first coating layer with a layer surface and a further coating layer, wherein A) the core comprises a) at least 99.95 wt.% of copper, b) an amount X of at least one element selected from silver and gold, c) an amount Y of at least one element selected from phosphorus, magnesium and cerium, wherein the ratio of X and Y is in the range of from 0.03 to 50; B) the first coating layer is composed of at least one element selected from the group comprising of palladium, platinum and silver, wherein the first coating layer is superimposed over the surface of the core, C) the further coating layer is superimposed over the layer surface of the first coating layer, wherein the further coating layer is composed of gold. The present invention further relates to a method for manufacturing a wire as aforementioned and to an electric device comprising the wire of the invention.
申请公布号 SG10201408304U(A) 申请公布日期 2016.07.28
申请号 SG10201408304U 申请日期 2014.12.11
申请人 HERAEUS DEUTSCHLAND GMBH & CO. KG;HERAEUS MATERIALS SINGAPORE PTE. LTD. 发明人 MURALI SARANGAPANI;JÜRGEN SCHARF;RAJKUMAR THIRUNARAYANAN;AHMAD ABDILLAH HARON
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