SEMICONDUCTOR DEVICE AND METHOD

摘要

A semiconductor device and a manufacturing method thereof are provided. In an embodiment, a first semiconductor device and a second semiconductor device are formed within a semiconductor wafer, and a scribe region is patterned between the first semiconductor device and the second semiconductor device. A singulation process is then utilized within the scribe region to singulate the first semiconductor device from the second semiconductor device. The first semiconductor device and the second semiconductor device are then bonded to a second semiconductor substrate and thinned in order to remove extension regions from the first semiconductor device and the second semiconductor device.