Semiconductor Device and Method

摘要

A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
encapsulating a first semiconductor die and a second semiconductor die with an encapsulant; electrically connecting the first semiconductor die and the second semiconductor die with a first link device, wherein the first link device extends over the first semiconductor die, the second semiconductor die, and the encapsulant; depositing a first interconnection layer on an opposite side of the encapsulant than the first link device; and electrically connecting a second link device to a first portion of the first interconnection layer with a second portion of the first interconnection layer.