摘要 |
In a capacitive-type semiconductor sensor, a pad for fixed electrodes of a sensor chip operable in one direction is also used in common as a pad for the other fixed electrodes of the other sensor chip operable in another direction. Further, a wiring from the common pad for the one sensor chip and a wiring from the common pad for the other sensor chip are symmetrically formed. The sensor chips may be arranged to be operable in two perpendicularly crossing directions or in two reverse directions.
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