发明名称 SUBSTRATE-TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the etching of a protecting tube in gas cleaning, or that of the wiring of a thermocouple in wet cleaning, even if the protecting tube for protecting the thermocouple is installed in a treatment chamber. SOLUTION: A substrate-treating device comprises a treatment chamber for treating a substrate, a temperature detecting means 263 provided in the treatment chamber, a first protecting tube 10 for covering the temperature detecting means, and a second protecting tube 20 for covering the first protecting tube. Thus, even if film-formation treatment is made in the treatment chamber, a by-product adheres to only the second protecting tube since the first protecting tube for protecting the thermocouple is protected by the second protecting tube. In this manner, only the second protecting tube in which the by-product adheres to may be washed in wet cleaning, thus dispensing with the cleaning of the first protecting tube having thermocouple wiring, and hence preventing a cleaning liquid from adhering to the thermocouple wiring. And etching gas comes into contact with only the second protecting tube in gas cleaning, thus preventing the first protecting tube for protecting the thermocouple from being corroded by the etching gas and a hole from being opened, and preventing the thermocouple from being damaged. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209754(A) 申请公布日期 2005.08.04
申请号 JP20040012604 申请日期 2004.01.21
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KOTAKE SHIGERU;YOSHINO AKIO
分类号 H01L21/22;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 主分类号 H01L21/22
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