发明名称 METHOD FOR FORMING RESIST PATTERN AND LAMINATE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To allow a resist film to follow the shape of a recessed portion of a substrate.SOLUTION: A method for forming a resist pattern includes the steps of: preparing a substrate having a recessed portion: in disposing a photosensitive resist film on a substrate under a first atmosphere, covering an opening of the recessed portion with the resist film to form a cavity part; under a second atmosphere higher than the first atmosphere, heating the resist film; bringing the resist film into contact with an inner wall of the recessed portion; exposing the resist film; developing the resist film; and opening the resist film located at the recessed portion.
申请公布号 JP2014212192(A) 申请公布日期 2014.11.13
申请号 JP20130087288 申请日期 2013.04.18
申请人 DAINIPPON PRINTING CO LTD 发明人 ITO YUKARI;NAKAYAMA KOICHI
分类号 H05K3/28;B29C65/78 主分类号 H05K3/28
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