发明名称 |
METHOD FOR FORMING RESIST PATTERN AND LAMINATE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To allow a resist film to follow the shape of a recessed portion of a substrate.SOLUTION: A method for forming a resist pattern includes the steps of: preparing a substrate having a recessed portion: in disposing a photosensitive resist film on a substrate under a first atmosphere, covering an opening of the recessed portion with the resist film to form a cavity part; under a second atmosphere higher than the first atmosphere, heating the resist film; bringing the resist film into contact with an inner wall of the recessed portion; exposing the resist film; developing the resist film; and opening the resist film located at the recessed portion. |
申请公布号 |
JP2014212192(A) |
申请公布日期 |
2014.11.13 |
申请号 |
JP20130087288 |
申请日期 |
2013.04.18 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ITO YUKARI;NAKAYAMA KOICHI |
分类号 |
H05K3/28;B29C65/78 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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