| 摘要 |
A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt. |
