发明名称 PROBE SUBSTRATE ASSEMBLY
摘要 <p>The present invention relates to a probe substrate assembly of a probe card and provides a probe substrate assembly including: a reinforcing substrate; a first silicon substrate array joined to one surface of the reinforcing substrate; and a first alignment guide member fixed upon a circumference of the one surface of the reinforcing substrate so as to surround the first silicon substrate array, wherein the first silicon substrate array includes a plurality of silicon substrate rows made up of plural segment pieces joined to each other, and the silicon substrate rows adjacent to each other aligned so that joint portions of the segment pieces cross each other. The probe substrate assembly of the probe card in accordance with the present invention includes the alignment guide member, so it is possible to minimize the accumulated error caused by the assembly tolerance incurred when the plural segment pieces are joined to each other and has the silicon substrate array in which the joint portion between the segment pieces of the plural silicon substrate rows are formed to cross each other, so it is possible to reduce the assembly error incurred due to a slight rotation of the segment pieces caused by the assembly tolerance, i.e., a clearance space of the irregularity structure.</p>
申请公布号 WO2008156278(A1) 申请公布日期 2008.12.24
申请号 WO2008KR03406 申请日期 2008.06.17
申请人 M2N INC.;CHAE, JONG HYEON 发明人 CHAE, JONG HYEON
分类号 G01R1/073 主分类号 G01R1/073
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