WAFER INSPECTING PROBE MEMBER AND PROBE CARD

摘要

Provided is a wafer inspecting probe member whose manufacturing cost and maintenance cost are reduced, for inspecting even a wafer having a large area and many electrodes to be inspected. A probe card is also provided. The wafer inspecting probe member is provided with a frame plate having many anisotropic conductive film arranging holes which extend in the thickness direction; a plurality of elastic anisotropic conductive films, each of which is arranged in each of the anisotropic conductive film arranging holes on the frame plate and supported by the peripheral portion of the hole and has conductivity in the thickness direction; and a contact film, which is integrally arranged at least on the surface of the elastic anisotropic conductive film and has a plurality of electrode structures that extend in the thickness direction of an insulating film. Each of the elastic anisotropic conductive films is provided with a plurality of connecting conductive sections. Each connecting conductive section is formed at a portion whereupon the electrode structure of the contact film is positioned, densely contains conductive particles exhibiting magnetism in an elastic polymeric material, and extends in the thickness direction. The elastic anisotropic conductive film is also provided with an insulating section which insulates the connecting conductive sections from each other. Each electrode structure is at least partially made of a material having magnetism.