| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lamp module which is improved in heat dissipation property and bonding property between an LED lamp using a substrate made of ceramic and a wiring board. <P>SOLUTION: The LED lamp module 10 comprises the LED lamp 100 and wiring board 150. A heat dissipation material 108 is embedded in a projection portion 110 of the LED lamp 100. The LED lamp 100 is stored in a recessed portion 154 formed in the wiring board 150. While an external connection terminal 104 of the LED lamp 100 and a spring type terminal 155 of the wiring board 150 are in contact with each other, a backside of the projection portion 110 of the LED lamp 100 and a bottom surface of the recessed portion 154 of the wiring board 150 are bonded to each other with a heat-conductive adhesive 157. <P>COPYRIGHT: (C)2009,JPO&INPIT |
