| 摘要 |
The invention relates to a method for producing electronic components. The method comprises providing a metal foil, arranging the metal foil on an auxiliary carrier, and structuring the metal foil arranged on the auxiliary carrier into separate connection elements. The operations of forming a moulded body with recesses on the auxiliary carrier and the connection elements, arranging semiconductor chips on connection elements in the recesses of the moulded body, removing the auxiliary carrier and severing the moulded body in order to form singularized electronic components are also provided. The invention further relates to an electronic component. |
