| 摘要 |
[PROBLEMS] To provide a circuit module manufacturing method by which a resin is prevented from flowing out to the external at the time of filling a cavity constituted by a wiring board and a terminal plate with the resin. [MEANS FOR SOLVING PROBLEMS] A connecting electrode (6) of a wiring board (1) and a connecting electrode (12) of a frame-like terminal plate (10) are bonded, respectively, with a conductive bonding material (20), and a circuit component (8) is mounted in a cavity (11) constituted by an inner surface of the terminal plate (10) and a surface of the wiring board (1). After applying a high viscosity first resin material (21) between the inner surface of the terminal plate (10) and the surface of the wiring board (1) for filling a space between such surfaces, the cavity (11) is filled with a low viscosity second resin material (22) to cover the circuit component (8). Thus, the first resin material (21) prevents the second resin material (22) from flowing out to the external through spaces formed by the bonding material (20). |
