发明名称 SUBSTRATE TREATING APPARATUS AND METHOD
摘要 A substrate processing apparatus and method are provided to prevent contamination of equipment due to residual gas by measuring gas acidity within a housing. A loading/unloading unit loads or unloads a cassette for receiving a plurality of substrates. A process treatment unit includes at least one process chamber for performing a substrate treatment process. A substrate transfer unit transfers the substrates between the loading/unloading unit and the process treatment unit. An acidity control member is used for controlling air acidity within the substrate transfer unit. The substrate transfer unit includes an EFEM(Equipment Front End Module)(22) for transferring the substrates from the cassette loaded in the loading/unloading unit, a load lock chamber(24) arranged nearly to the EFEM, and a transfer chamber for transferring the substrates between the load lock chamber and the process chamber. The acidity control member is formed at the EFEM to control the air acidity within the EFEM.
申请公布号 KR20080032963(A) 申请公布日期 2008.04.16
申请号 KR20060099420 申请日期 2006.10.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN, DONG SHIK;CHO, GUI YOUNG;LEE, KUN HYUNG;CHOI, KWANG MIN;KIM, DAE WON
分类号 H01L21/67;H01L21/02;H01L21/68 主分类号 H01L21/67
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