METHOD FOR PREPARATION OF CIRCUIT BOARD WHEREIN THE PASSIVE COMPONENTS ARE EMBEDDED DIRECTLY

摘要

A manufacturing method of circuit board capable of providing reaction influence of low inductance is provided to reduce a length of a circuit path by directly connecting a passive element to a connection pad. An isolation layer(80) and a metal foil layer(50) are successively adhered to a supporting plate(60) by adhesive material(70). An outer edge region(50a) of the metal foil layer is adhered in the supporting plate. A rest region of the metal foil layer is contacted in the isolation layer. A pair of connection pad outer edges(90) are formed on the metal foil layer. A passive element(21) is mounted on the metal foil layer of a pair of connection pad outer edges by conductive material(20). The conductive material is formed in a pair of connection pad outer edges. The passive element is adhered in a circuit board together with a dielectric layer(30). The supporting plate is removed by a mechanical process. A whole metal foil layer is exposed. A circuit layer is formed, and includes a connection pad.