| 摘要 |
A heat dissipation device (100) includes a vapor chamber (20), a heat sink (10) and a heat pipe (30). The heat sink (10) includes a plurality of fins (12). The heat pipe (30) includes an evaporating portion (32) sandwiched between the vapor chamber (20) and the fins (12) of the heat sink (10), and a condensing portion (34) extending through the fins (12). The vapor chamber (20) is attached to an electronic component (42) mounted on an add-on card (40). The fins (12) of the heat sink (10) directly contact with the vapor chamber (20) and define a recess (127) at a bottom thereof to receive the vapor chamber (20) therein.
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