| 摘要 |
The present invention relates to a liquid cooling apparatus for heat radiation of high-power light-emitting diodes and, more specifically, to a liquid cooling apparatus for heat radiation of high-power light-emitting diodes (LEDs) capable of effectively emitting the heat, generated from a light source in an LED module, to the outside by using a coolant. The apparatus of the present invention comprises: one or more LEDs, which generate light when power is applied, being mounted on the top of a substrate; a circulating base combined with the bottom of the substrate, which is sealed and combined with the substrate by a sealing member; and a fixing member to fixate and combine the substrate, the sealing member, and the circulating base. |
