METHOD FOR JUNCTION OF SILVER PASTE

摘要

According to one embodiment of the present invention, a method for bonding a silver paste includes the following steps of: applying a silver paste including a plurality of silver powders and a plurality of tin powders onto a semiconductor device or a substrate; disposing the semiconductor device on the substrate; and forming a bonding layer by heating the silver paste. The semiconductor device and the substrate can be bonded through the junction layer without using glass frit.