| 摘要 |
According to the present embodiment, a power semiconductor separation device includes: a first support unit which includes a first body of a cylindrical shape, and a first support lever of a plate shape fixed in a direction vertical to the first body; a second support unit which includes a second body of a cylindrical shape which is inserted into the first body, and a second support lever of a plate shape fixed in a direction vertical to the second body; a first adjusting unit which is inserted and combined to the first body, is screw-combined with the second body at the end, and adjusts the position of the second body to be inserted into the first body; a second adjusting unit which penetrates and is combined with the end of the first support lever, is screw-combined with the second support lever, and adjusts the positions of the first and second support levers depending on the screw combination state; and an elastic member which is placed between the first and second bodies in the inner space of the first body and elastically supports the second body inserted into the first body. The relative distance between the first and second support levers is changed in link with the rotation of the first and second adjusting units, and by doing so, distances among components placed in front or at the back of a power semiconductor can be widened or recovered. |
