| 发明名称 |
Light Emitting Diode Packaging Structure |
| 摘要 |
A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue. A reflecting layer is formed from material refractivity difference of the packaging glue, the bubble structure and the light absorption substrate for eliminating or reducing light absorption by the substrate. |
| 申请公布号 |
US2016181490(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201615055624 |
申请日期 |
2016.02.28 |
| 申请人 |
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
CHAO CHIH-WEI;CHIANG YEN-CHIH |
| 分类号 |
H01L33/60;H01L33/48;H01L33/34 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode packaging structure, comprising:
a support system; a glue cup coupled to a periphery of the support system; a LED chip with a light absorption substrate over the support system; and packaging glue distributed at a periphery of the LED chip, wherein:
the light absorption substrate has a side forming a bubble structure at an interface with the packaging glue; anda reflecting layer is formed from material refractivity difference of the packaging glue, the bubble structure and the light absorption substrate for eliminating or reducing light absorption by the substrate. |
| 地址 |
Xiamen CN |
