RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

The present invention relates to a resin composition which provides a curing product having high glass transition temperature, low moisture absorption, and small heat decomposition when being stored at a high temperature for a long time, and a curing product having excellent formability and adhesion with a copper lead frame. In addition, the present invention provides a compound comprising: (A) an epoxy compound represented by chemical formula (1); (B) a copolymer obtained by hydrosilylation of an epoxy compound containing an alkenyl group and organopolysiloxane represented by chemical formula (2); (C) a phenol compound represented by chemical formula (3); (D) an inorganic filler; (E) at least one compound selected from organic phosphine, tetraphenylborate salt of a tetra-substituted phosphonium compound, and an addition of a phosphine compound and a quinone compound; and (F) a compound represented by chemical formula (I) or salts represented by chemical formula (II).