发明名称 |
Thermoformed plastic cover for electronics and related method of manufacture |
摘要 |
A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device |
申请公布号 |
US2016345437(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
US201615158645 |
申请日期 |
2016.05.19 |
申请人 |
TactoTek Oy |
发明人 |
HEIKKINEN Mikko;SÄÄSKI Jarmo;TORVINEN Jarkko |
分类号 |
H05K1/18;H01L33/62;H01L33/52;H01L33/48;H01L31/0203;H05K1/02;H01L31/02 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
|
主权项 |
1. A multilayer structure for an electronic device, comprising:
a flexible substrate film for accommodating electronics, at least one electronic component provided on said flexible substrate film; a number of conductive traces provided on said flexible substrate film for electrically powering and/or connecting electronics including said at least one electronic component; and wherein at least one cover is attached to said substrate film on top of said at least one electronic component, said at least one cover being overmolded with thermoplastic material. |
地址 |
Kempele FI |