| 摘要 |
Buff pad cleaning apparatus and method in CMP(Chemical Mechanical Polishing) equipment are provided to prevent the generation of defects on a wafer by removing effectively metallic particles or diamond grains using a buff dresser with brushes at both sides under a buff pad cleaning process. A buff pad cleaning apparatus in CMP equipment includes a buff pad(210) for loading stably a wafer, a buff dresser, and a brush. The buff dresser(220) is used for cleaning the buff pad. The brush(230) is attached to each side of the buff dresser. The brush removes particles from an upper portion of the buff pad together with the buff dresser.
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