| 摘要 |
PROBLEM TO BE SOLVED: To provide: an epoxy resin composition which is excellent in curability in applications, including lamination, molding, injection and adhesion, provides a hardened product having high heat resistance, mechanical strength and heat conductivity and excellent thermal decomposition stability and is useful as a circuit board material, including sealing materials for electric and electronic parts and high-heat-radiation sheets; a hardened product of the composition; and an epoxy resin used in the composition.SOLUTION: An epoxy resin is of formula (1) and has a weight average molecular weight (Mw) of 1,000-5,000, measured by gel permeation chromatography and excluding the ingredient with n=0 and a ratio of the ingredient with n=0 of 30 area% or less relative to the whole. In formula (1), n is 0-20. An epoxy resin composition comprising the epoxy resin and a hardener is also provided. |
